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中美矽晶投入高階應用的SOI 晶片研發 在今年初有重大的技術突破

中美矽晶投入厚膜接合晶圓(thick film SOI)研發兩年來,在今年初有重大的技術突破,目前已進入客戶樣品驗證階段,由於厚膜SOI 晶片在微機電(MEMS)產業的應用日益廣泛,此一新產品將對中美未來業績及獲利增添另一成長動力。

 

厚膜接合晶圓主要應用在微機電產業,而微機電系統技術(Micro-Electro-Mechanical-System, MEMS)是一種包括光、機、電、材、控制、化學等多重科技整合的技術,該技術已廣泛應用於半導體、微機電製程及奈米結構材料技術,可應用之產業涵蓋資訊、通訊、消費性電子、生醫、汽車工業生產等領域,應用範圍極廣且目前只有極少數的晶圓供應商具備量產技術,進入門檻相當高。

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